Heat dissipation deterrence link for semiconductor manufacture



FIG. 1 is a front view of the design for a heat dissipation deterrencelink for semiconductor manufacture in accordance with the invention;

FIG. 2 is a rear view thereof;

FIG. 3 is a right side view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a plan view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a sectional view thereof along A—A of FIG. 1;

FIG. 8 is a perspective view thereof; and,

FIG. 9 shows a heat dissipation deterrence link for semiconductormanufacture in accordance with the invention in use.

In practice, a heat dissipation deterrence link is placed on the bottomof a thermostat plug that is included in a process tube forsemiconductor manufacture. Then, in use, the link suppresses heat from abottom sub-heater. Preferably, the heat dissipation deterrence link forsemiconductor manufacture in accordance with the present invention isfabricated from quartz.

The broken line showing the environment is for illustrative purposesonly and forms no part of the claimed design.

The ornamental design for a heat dissipation deterrence link forsemiconductor manufacture, as shown and described.